Thursday 28 February 2013

Microchip Technology’s BodyCom™ Technology

Microchip Technology has announced the introduction of BodyCom™ Technology which makes use of the human body as a secure communication channel. BodyCom™ Technology works by capacitive coupling to the human body. The human body is used as the secure communications channel between a Base Unit and a Mobile Unit without any form of antenna being required:
BodyCom technology is activated by capacitively coupling to the human body. The system then begins communicating bidirectionally between a centralized controller and one or more wireless units. There are a broad range of applications where secure wireless communication is essential, and there is no more secure channel than the human body. This is especially true when you add bidirectional authentication that supports advanced encryption, such as KeeLoq® technology and AES. For example, BodyCom technology helps prevent the “Relay Attack” problem that is typical in automotive passive-keyless-entry security systems.


BodyCom™ Technology is supported by the free BodyCom Development V1.0 Framework and software libraries that work with all 8, 16 and 32-bit PIC® microcontrollers. The Microchip BodyCom Development Kit is also available to aid development of BodyCom designs.

Video demonstration of the BodyCom™ Technology development kit by Microchip:


more:
Microchip’s BodyCom™ Technology is World’s First to Use Human Body as a Secure, Low-Power Communication Channel

List of DSP articles published on Embedded.com

An extensive list of the DSP related articles published on Embedded.com is now available. The list currently covers articles published up to and including 2010.

More about designing with Embedded DSPs

Tuesday 8 January 2013

Enhanced SuperSpeed USB 3.0 specification sees speeds double to 10 Gbps

The development of an updated USB 3.0 specification has been announced by the USB group. A number of enhancements to USB 3.0 are planned, including more efficient data encoding, which will see speeds double to 10 Gbps. The new USB 3.0 (Super Speed) specification should be available around mid 2013 and will be compatible with existing USB 3.0 software stacks, connectors and cables. The new specification is designed to compete with Thunderbolt.